Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy

The Microstructure and Crystal Orientation of Sn-Ag and Sn-Cu Solders Affected by their Interfacial Reactions with Cu and Ni(P)

Recently, it has been reported that the crystal orientation and grain size of the β-Sn phase in Sn-rich solders have profound effects on the reliabilities of Pb-free solder joints, such as thermo-mechanical fatigue, electromigration, and among others. Additionally, it is also known that the microstructure of Sn-rich solders is strongly affected by their alloy composition. In this study, the gra...

Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

The effect of Al on the corrosion resistance behaviour of Pb-free Sn–1.0Ag–0.5Cu–xAl solder (x 1⁄4 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive ...

Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders

Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-AgCu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Mor...

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable ...